Here are 1-3 brief analogies for Wolfspeed (WOLF):

• Wolfspeed is like Intel for Silicon Carbide chips.
• Wolfspeed is like a specialized Texas Instruments for Silicon Carbide power components.
• Wolfspeed is like the NVIDIA for power chips in electric vehicles and renewable energy.

• Silicon Carbide Materials: Wolfspeed produces silicon carbide substrates and epitaxial wafers, which are foundational materials for high-performance power and RF semiconductors.
• Silicon Carbide Power Devices: These include MOSFETs, diodes, and power modules built on silicon carbide, designed for efficient power conversion in applications like electric vehicles, renewable energy, and industrial power supplies.
• Silicon Carbide RF Devices: Wolfspeed develops radio frequency (RF) devices such as GaN-on-SiC HEMTs and MMICs, used in demanding applications like 5G infrastructure, radar, and aerospace.

Wolfspeed (WOLF) primarily sells its advanced Silicon Carbide (SiC) technology, including power devices, RF devices, and SiC wafers, to other companies. These products are critical components for various high-growth industries, particularly electric vehicles (EVs), renewable energy, industrial power, and telecommunications infrastructure.

Its major customers and strategic partners include:

• General Motors (GM): Wolfspeed has a multi-year strategic partnership to supply SiC power device solutions for General Motors' future electric vehicle programs.
• Jaguar Land Rover: Wolfspeed supplies its SiC technology for the inverter in Jaguar Land Rover's next-generation electric vehicles. Jaguar Land Rover is a subsidiary of Tata Motors (NYSE: TTM).
• ZF Friedrichshafen AG: A global technology company and major Tier-1 automotive supplier, ZF partners with Wolfspeed to integrate SiC solutions into its electric driveline systems for various automotive original equipment manufacturers (OEMs). ZF Friedrichshafen AG is a privately held company.

Robert Feurle, Chief Executive Officer
Robert Feurle was appointed Chief Executive Officer of Wolfspeed, effective May 1, 2025. He brings over 20 years of experience in the semiconductor industry, focusing on operational excellence and financial strength. Prior to joining Wolfspeed, Feurle served as Executive Vice President of the Opto Semiconductor business unit at ams-OSRAM AG and as Vice President and General Manager of Integrated Solutions and Discretes at Infineon Technologies AG. He also held various leadership and operational roles at Micron Technology, Inc., Qimonda AG, and Siemens AG.

Gregor van Issum, Chief Financial Officer
Gregor van Issum became Wolfspeed's Chief Financial Officer on September 1, 2025, and is responsible for the company's global financial strategy, capital structure, and investor relations. He has more than 20 years of experience in strategic finance and operational transformation within the semiconductor industry. His previous senior leadership roles include Executive Vice President, Group Controller, and Chief Transformation and Performance Officer at ams-OSRAM, and various strategic finance and executive positions at NXP Semiconductors.

Dr. David Emerson, Executive Vice President and Chief Operating Officer
Dr. David Emerson rejoined Wolfspeed in June 2025 as Executive Vice President and Chief Operating Officer. In this role, he oversees manufacturing, procurement and planning, facilities, and quality divisions, aiming to accelerate time-to-market for new products and ensure consistent delivery of silicon carbide solutions.

Priya Almelkar, Senior Vice President and Chief Information Officer
Priya Almelkar serves as Wolfspeed's Senior Vice President and Chief Information Officer. She is responsible for defining the company's technology vision, supporting business growth, and driving scalability through digital transformation, advanced automation, and integrated technology.

Cengiz Balkas, Senior Vice President & Chief Business Officer
Cengiz Balkas is the Senior Vice President and Chief Business Officer of Wolfspeed, having joined the company in July 2006 from INTRINSIC Semiconductor Corporation. With over 25 years of experience in silicon carbide materials and semiconductors, Balkas co-founded INTRINSIC Semiconductor Corporation in June 2002, serving as its President and Chief Executive Officer until its acquisition by Wolfspeed. He also previously worked as the General Manager and Director of Technology for Sterling Semiconductor Corporation.

Intensified competition and rapid capacity expansion in Silicon Carbide (SiC) by existing and new players. Wolfspeed, a pioneer in SiC technology, faces growing pressure from a rapidly expanding field of competitors. Major established semiconductor companies such as STMicroelectronics, Infineon, ON Semiconductor, and Rohm are aggressively investing billions in SiC material production, fabrication facilities, and product development, rapidly catching up in scale and technological capabilities. Additionally, numerous new players, particularly from China (e.g., BYD Semiconductor), are entering the market with significant government and capital backing, aiming to capture market share in critical applications like electric vehicles (EVs) and industrial power. This surge in competitive capacity could lead to price pressure, erosion of Wolfspeed's market share, and increased capital expenditure requirements to maintain its leadership position, mirroring the competition that emerged for early market leaders in other tech sectors.

Advancements and increasing market adoption of Gallium Nitride (GaN) as an alternative wide-bandgap semiconductor material. While SiC currently dominates high-power, high-voltage applications like EV traction inverters, GaN technology is rapidly maturing and gaining traction in adjacent power electronics markets. GaN offers advantages in higher switching frequencies and can be more cost-effective for lower-power, high-frequency applications such as EV on-board chargers, data center power supplies, telecom power (e.g., 5G infrastructure), and consumer electronics. Companies like Infineon, Navitas Semiconductor, and Qorvo are heavily investing in GaN solutions. As GaN technology improves and scales, it presents an alternative that could limit SiC's overall market expansion into these segments or even displace SiC in specific niches where its characteristics are more favorable, much like new streaming platforms emerged to challenge existing content delivery models.

Wolfspeed (NYSE: WOLF) is a developer and manufacturer of wide-bandgap semiconductors, primarily focused on silicon carbide (SiC) and gallium nitride (GaN) materials and devices. The company's main products and services address the following markets:

Silicon Carbide (SiC) Materials and Power Devices

Wolfspeed's core business revolves around silicon carbide (SiC) materials, including wafers and substrates, and SiC power devices used in various applications such as electric vehicles, fast charging, renewable energy, and industrial power supplies.

• The global silicon carbide market size was valued at approximately USD 4.04 billion in 2024 and is projected to grow to about USD 12.13 billion by 2034, demonstrating a compound annual growth rate (CAGR) of 11.6% during this forecast period. Other estimates place the global silicon carbide market at USD 4.2 billion in 2024, with a CAGR of 34.5% from 2025 to 2034. Another report estimates the market at USD 5.23 billion in 2024, reaching USD 9.15 billion by 2030, with an 8.7% CAGR from 2025 to 2030.
• For the global power SiC device market, projections indicate a value of nearly USD 10 billion by 2029, growing at a CAGR of 24% from 2023. Separately, the global Silicon Carbide (SiC) power semiconductors market is expected to reach a valuation of USD 11.7 billion by 2035, growing at a CAGR of 19.0%.
• Wolfspeed internally estimated the power device market to be around USD 11 billion in 2027, and potentially USD 19 billion by approximately 2030 if electric vehicle adoption reaches 40%.

Gallium Nitride (GaN) RF Devices and Materials

While Wolfspeed completed the sale of its RF business to MACOM in late 2023, the company still offers GaN epitaxial layers on SiC wafers and GaN-based devices for radio frequency (RF) applications, along with foundry services for GaN-on-SiC MMIC technology.

• The global GaN RF Devices Market was valued at USD 1.8 billion in 2023 and is projected to grow to USD 8.29 billion by 2032, at a global CAGR of 18.5% from 2025 to 2032.
• Another analysis of the Global RF GaN Semiconductor Device Market estimated its size at USD 1.67 billion in 2024, with a projection to reach USD 12.35 billion by 2035, at a global CAGR of 19.96% from 2025 to 2035.
• The broader global radio frequency power semiconductor devices market was valued at approximately USD 16.5 billion in 2023 and is expected to reach around USD 28.9 billion by 2032, with a global CAGR of 6.5%.

Wolfspeed (WOLF) is poised for future revenue growth over the next 2-3 years, driven by several key factors:

1. Accelerated Adoption of Silicon Carbide (SiC) in Electric Vehicles (EVs): Wolfspeed is a leading supplier in the global EV semiconductor supply chain, with silicon carbide being a critical component for EV powertrains and fast-charging infrastructure. The company is well-positioned to capitalize on the anticipated significant growth in the EV market between 2025 and 2030.
2. Growing Demand in AI Data Centers and Renewable Energy Systems: The increasing need for high-efficiency power solutions in AI data centers, along with the continued expansion of renewable energy systems (solar, wind, energy storage), is fueling demand for Wolfspeed's high-voltage and high-efficiency SiC devices.
3. Ramp-up of 200mm Silicon Carbide Wafer Production: Wolfspeed's strategic shift and significant investment in its Mohawk Valley Fab for 200mm SiC wafer production are expected to drive substantial revenue growth. This transition to larger wafers offers an approximately 80% increase in chips per wafer and significant cost reductions, enabling the company to meet increasing demand more efficiently.
4. Emerging Opportunities in Graphene Production for AI Chips: Silicon carbide is increasingly recognized as a crucial substrate for producing high-quality graphene. This graphene is anticipated to disrupt the semiconductor industry by replacing traditional copper interconnects and sub-10 nm silicon transistors in next-generation AI semiconductors and memory, presenting a new and significant market for Wolfspeed's SiC materials.

Share Issuance

• Wolfspeed completed a $200 million at-the-market (ATM) equity offering in January 2025, selling 27,793,535 shares to improve its capital structure and reduce leverage.
• As part of its Chapter 11 reorganization plan, approved in September 2025, all previously outstanding common stock was cancelled, and new shares were issued to existing stockholders at an exchange ratio of 0.008352 new shares per cancelled share, with the possibility of additional shares if regulatory milestones are met.
• The restructuring plan resulted in a significant dilution for existing shareholders, with holders of convertible debt notes and Renesas becoming the majority owners of the newly issued equity.

Inbound Investments

• Wolfspeed secured approximately $2.5 billion in funding, including $750 million from the U.S. CHIPS and Science Act and an additional $750 million from an investment group led by Apollo, The Baupost Group, Fidelity Management & Research Company, and The Capital Group, to support domestic manufacturing expansion.
• The company received $192.1 million in Section 48D cash tax refunds in March 2025 for fiscal 2023 and 2024, as part of an expected approximately $1 billion in total tax refunds, intended to strengthen its capital structure.
• In connection with its financial restructuring, Wolfspeed injected $275 million in new financing.

Capital Expenditures

• Wolfspeed's capital expenditures were approximately $2.1 billion in fiscal year 2024, with a projected decrease to about $1.2 billion in fiscal year 2025.
• Expected capital expenditures are forecast to significantly decline to approximately $150 million to $200 million in fiscal year 2026 and $30 million to $50 million in fiscal year 2027.
• The primary focus of these expenditures has been the construction and ramp-up of The John Palmour Manufacturing Center for Silicon Carbide (JP facility) in Siler City, North Carolina, and the Mohawk Valley Fab in Utica, NY, for 200mm silicon carbide production.