Here are 1-3 brief analogies to describe Amkor Technology (AMKR):

• Foxconn for semiconductor chips: Just as Foxconn assembles many of the world's consumer electronics for brands like Apple, Amkor provides outsourced assembly and testing services for the critical semiconductor chips that power those devices.
• TSMC for chip packaging and testing: If TSMC is the "foundry" that fabricates raw silicon wafers, Amkor is a leading "back-end" partner that packages and tests those completed chips, preparing them for integration into electronic products.

• Semiconductor Packaging: Provides advanced packaging solutions that encase integrated circuits, protecting them and enabling electrical connection to other components.
• Semiconductor Test: Offers comprehensive testing services for packaged semiconductors to ensure their functionality, performance, and reliability before shipment.
• Wafer Bumping and Probing: Delivers services for applying metallic bumps to wafers and performing electrical tests on individual dies while still in wafer form.

Amkor Technology (AMKR) is a leading provider of outsourced semiconductor packaging and test services. As such, it operates on a business-to-business (B2B) model, selling its services primarily to other companies in the semiconductor industry.

Amkor Technology, like many companies in the outsourced semiconductor assembly and test (OSAT) industry, does not publicly disclose the specific names of its individual major customers due to confidentiality agreements. However, based on industry analysis, market share, and the types of chips Amkor is known to package (e.g., for mobile, automotive, high-performance computing), the following companies are widely believed to be among Amkor's significant customers, representing major players in the semiconductor ecosystem that frequently utilize top-tier OSAT providers:

• Qualcomm (Symbol: QCOM)
• Apple Inc. (Symbol: AAPL)
• Broadcom Inc. (Symbol: AVGO)

These companies are among the largest fabless semiconductor designers or integrated device manufacturers (IDMs) globally that require advanced packaging and testing solutions for their high-volume, complex chips used in various applications, including mobile devices, data centers, and automotive systems.

Giel Rutten, President & Chief Executive Officer

Giel Rutten joined Amkor Technology in 2014 and was appointed President and Chief Executive Officer in June 2020. He brings over 30 years of experience in the global semiconductor industry. Prior to Amkor, Mr. Rutten served as the Chief Executive Officer of Ledzworld, an LED technology company. He also held executive roles at Philips Semiconductors, NXP Semiconductors, and Texas Instruments. He holds a Master's degree in Electrical Engineering from Eindhoven University of Technology and a Master's degree in Physics and Chemistry from the University of Nijmegen, Netherlands.

Megan Faust, Executive Vice President, Chief Financial Officer & Treasurer

Megan Faust joined Amkor Technology in 2005 and has served as Executive Vice President, Chief Financial Officer, and Treasurer since September 2016. She has held various finance and accounting positions within Amkor, including six years as Corporate Controller. Before joining Amkor, Ms. Faust spent 10 years as an auditor with KPMG, LLP, including a two-year international assignment in Munich, Germany. She holds an MBA from Arizona State University, a BS in Accountancy from Northern Arizona University, and is a Certified Public Accountant in Arizona.

Kevin Engel, Executive Vice President, Chief Operating Officer

Kevin Engel was appointed Executive Vice President, Chief Operating Officer in February 2025. He previously served as Executive Vice President of Business Units from February 2023 to February 2025, and as Corporate Vice President of the Flip Chip/Wafer Level Business Unit from January 2020 to February 2023.

Mark Rogers, Executive Vice President, General Counsel & Corporate Secretary

Mark Rogers serves as Amkor Technology's Executive Vice President, General Counsel, and Corporate Secretary.

Farshad Haghighi, Executive Vice President, Chief Sales Officer

Farshad Haghighi is the Executive Vice President and Chief Sales Officer of Amkor Technology, a role he assumed in August 2022. Before this, he served as Executive Vice President of Worldwide Sales and Marketing from October 2021 to August 2022, and as Corporate Vice President of West Region Sales from March 2018 to October 2021.

The increasing trend of leading foundries and integrated device manufacturers (IDMs) offering comprehensive, vertically integrated semiconductor manufacturing services, which now prominently include advanced packaging alongside wafer fabrication. This strategic shift is exemplified by companies like Intel Foundry Services (IFS) which are aggressively building out and marketing their advanced packaging capabilities to third-party customers. This directly competes with Amkor Technology's core business of providing outsourced semiconductor assembly and test (OSAT) services, potentially reducing the addressable market for independent OSAT providers, especially for leading-edge technologies where integrated solutions might offer perceived advantages in design, performance, and supply chain management.

Amkor Technology (AMKR) operates in the semiconductor packaging and test services industry, providing critical solutions for various electronic devices. The addressable markets for their main products and services are global and include the following:

• Semiconductor Packaging Market: The global semiconductor packaging market was valued at approximately USD 49.88 billion in 2024 and is projected to reach around USD 132.95 billion by 2034, growing at a Compound Annual Growth Rate (CAGR) of 10.30% from 2025 to 2034. Another report indicates the global semiconductor packaging market size was estimated at USD 39.58 billion in 2024 and is projected to reach USD 70.90 billion by 2030, with a CAGR of 10.4% from 2025 to 2030.
• Semiconductor Assembly and Test Services (OSAT) Market: The global Semiconductor Assembly and Test Services (SATS) market was valued at USD 39.21 billion in 2024 and is expected to grow at a CAGR of 5.78% from 2025 to 2032, reaching nearly USD 61.46 billion by 2032. Another source estimates the global SATS market at USD 35.11 billion in 2025, anticipated to reach USD 49.54 million by 2034, with a CAGR of 3.9%.
• Advanced Packaging Market: The global advanced packaging market size was estimated at USD 39.60 billion in 2024 and is projected to reach USD 55.00 billion by 2030, growing at a CAGR of 5.7% from 2025 to 2030. Other estimates place the global market value at USD 38.5 billion in 2024, with a projection to reach USD 111.4 billion by 2034 at a CAGR of 11.5%.
• MEMS Packaging Market: The global MEMS packaging market was valued at USD 5.2 billion in 2024 and is projected to reach USD 9.8 billion by 2033, demonstrating a CAGR of 7.1% during the forecast period of 2025-2033. Another report states the MEMS Packaging market size was valued at USD 5.54 billion in 2024 and is anticipated to reach USD 9.81 billion by 2032, with a CAGR of 7.5%.
• Automotive Semiconductor Packaging Market: The global automotive semiconductor packaging market size was valued at USD 27.9 billion in 2024 and is expected to grow from USD 29.2 billion in 2025 to USD 45.7 billion by 2035, at a CAGR of 4.6% during the forecast period.

Amkor Technology (AMKR) is poised for future revenue growth over the next 2-3 years, driven by several key strategic initiatives and market trends:

1. Growing Demand for Advanced Packaging Technologies: Amkor is experiencing increased demand for its advanced packaging solutions, particularly Chip-on-Wafer-on-Substrate (CoWoS) and 2.5D/3D packaging technologies, which are crucial for high-performance computing (HPC) and artificial intelligence (AI) applications. Analysts forecast significant growth in Amkor's CoWoS sales in fiscal years 2026 and 2027. The company anticipates expanding its GPU packaging business with NVIDIA and securing ASIC slots with Broadcom in 2026. Investments are focused on enhancing capacity and capabilities for leading-edge technologies like high-density fan-out and advanced System-in-Package (SiP).
2. Expansion in Communications and Computing End Markets: Amkor is projecting continued strength in its communications and computing segments. The company reported record revenue in both these markets in the third quarter of 2025 and expects double-digit year-on-year growth in its advanced and mainstream portfolios for Q4 2025. This growth is anticipated to be fueled by robust seasonal demand supporting new product introductions, particularly for premium-tier smartphones, and the expanding demand for AI and high-performance computing applications, including data center infrastructure and personal computing.
3. Strategic Manufacturing Footprint Expansion and Investments: A significant driver for Amkor is its ongoing expansion of manufacturing capacity and global footprint. This includes the construction of a new $7 billion advanced packaging facility in Arizona, set to begin operations in 2028, which has already attracted strategic customer investments and aligns with the America Manufacturing initiative. Additionally, Amkor is expanding its semiconductor back-end processing operations in South Korea as part of a broader $9 billion investment initiative in Korea's key industries, such as AI and semiconductors. The company is also enhancing operational efficiency and optimizing its mainstream manufacturing footprint in Japan and ramping up production in Vietnam.

**Share Repurchases**

• Amkor Technology has shown minimal to no significant share repurchases in the 2024-2025 timeframe, with a 3-Month Share Buyback Ratio of -0.02 as of November 2025.
• While a $150 million stock repurchase program was authorized in 2011 and an additional $150 million in 2012, with approximately $91.6 million available at December 31, 2021, no common stock purchases were made for the three months ending December 31, 2021, indicating inactivity in the program during the recent period.

**Share Issuance**

• The company's basic shares outstanding have shown only minor increases over the last few years, with 247,090,000 shares outstanding as of October 2025, a 0.18% increase from 2024, and 246,630,000 in 2024, a 0.35% increase from 2023.
• Net cash flow from issuance (purchase) of equity shares has been consistently reported as $5 million for several quarters in 2024 and 2025, suggesting no large dollar amount share issuances.

**Inbound Investments**

• Amkor is undertaking a significant expansion of its semiconductor advanced packaging and test campus in Arizona, with a total planned investment of $7 billion across two phases.
• This substantial investment is supported by funding from the CHIPS for America Program, including $407 million secured for the Arizona facility, as well as the Advanced Manufacturing Investment Tax Credit and local government incentives.
• Apple is investing in Amkor through its American Manufacturing Program, which is part of Apple's $600 billion commitment to enhance U.S. job creation and innovation.

**Outbound Investments**

• Amkor Technology reported net acquisitions/divestitures of $0 million for the twelve months ending June 30, 2025, indicating no significant outbound investments in this period.

**Capital Expenditures**

• Amkor's capital expenditures were $553 million in 2020, $779.8 million in 2021, $908.3 million in 2022, $749.5 million in 2023, and $743.8 million in 2024.
• For the full year 2025, Amkor has increased its capital expenditure guidance to approximately $950 million.
• These capital expenditures are primarily focused on expanding capacity and capabilities for advanced technologies, including high-performance computing, Advanced SiP, next-generation test capabilities, and new facilities in Vietnam, Portugal, Korea, and particularly the new advanced packaging and test campus in Arizona.